Chemical dimple suppression machine for glass products

GLASS SURFACE TREATMENTGLASS SURFACE TREATMENT EQUIPMENT

Chemical dimple suppression machine for glass products

To achieve process of slimming LCD glass substrates, there are 2 representative methods: “mechanical grinding” and “chemical etching”.

 

In recent days, chemical etching has been the mainly adopted method for its superiority in processing each glass substrate with a short takt time.

 

Among several different methods to perform chemical etching, in order to handle those LCD glass substrates growing larger in size, NSC Engineering chooses to design & fabricate single substrate chemical etching machines on which the glass substrates are conveyed in a horizontal lying position.

 

 

Machine types NSC Engineering designs & fabricates

Generation
Size (mm)
Sheet number/ Loading

Generation 8.5

(NSC Engineering is able to fabricate machines for G8.5 glass production)

2200 x 2500
1 sheet/ Loading substrates loaded continually

Generation 6

(NSC Engineering has records in fabricating machines for mass production)

1500 x 1850
1 sheet/ Loading substrates loaded continually

Generation 4.5

(NSC Engineering has records in fabricating machines for mass production)

730 x 920
2 sheets/ Loading substrates loaded continually
Machine fabrication records
Item
Fabrication record (Generation 6)
Material of work
Glass
Thickness of work
Original thickness:1.0mm, 0.8mm, 0.5mm
Chemicals mainly used
Hydrofluoric acid etchant for dimple suppression
Process capacity
40,000sheet/month
Takt time
Approx. 50 secs.
Standard delivery time
5 months
Safety measure
Interlocks at each spot
Operation system
Automatic operation
Control system
PLC control
System standard
JIS, Japanese Industrial Standard

 

How dimples grow on glass surface & NSC’s original dimple suppression process

Any flaws or indentation cracks on the surface of a glass workpiece will expand and become dimples after chemical etching.

 

NSC’s original dimple suppression process, “NP Process,” is capable of suppressing growth of these dimples.

 

How dimples grow on glass surface & NSC’s original dimple suppression process

How dimples grow on glass surface & NSC’s original dimple suppression process

Sometimes due to any of the below reasons mechanical polishing is required even after glass workpieces have reached the target thickness through chemical slimming process. These examples are sometimes also adopted as countermeasures to dimples.

【Examples of mechanical polishing as countermeasures to dimples】

1. Perform mechanical polishing on all workpieces whether or not there is any dimple defect
2. Perform mechanical polishing only on those workpieces with dimple defects (repair)

 

However, if mechanical polishing needs to be performed on all of the workpieces, in this situation the amount of processed workpiece is almost impossible to reach the required amount for mass production.

 

In addition, when mechanical polishing process is adopted as a means of repair, there may be a potential risk: If the ratio of dimple defects is high, production rate will be limited and such production rate may be too late to meet promised delivery time.

 

Considering the above-mentioned problems, NSC Engineering’s dimple suppression machine for glass products, “NP”, is the suitable machine which contributes to production efficiency among glass slimming lines.

Please feel free to use this number for inquiries:

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+81-90-1448-8699

business hours 8:30~17:15 (UTC+9)

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